Issues $\rightarrow$ Volume 26, Issue 4 (2025)

Advances in Mechanical Testing of Thin Films

BURLAKOV V.O. and FILATOV O.V.

G.V. Kurdyumov Institute for Metal Physics of the N.A.S. of Ukraine, 36 Academician Vernadsky Blvd., UA-03142 Kyiv, Ukraine

Received / Final version: 05.06.2025 / 30.09.2025 Download PDF logo PDF

Abstract
This paper reviews techniques for the measurement of basic mechanical properties of thin films with thicknesses ranging from monoatomic layers to micrometres. The challenge of characterising thin films lies in the limitations of conventional techniques, which are typically designed for bulk materials and fail to capture surface effects or to isolate the substrate influence accurately. Therefore, the measurement of mechanical parameters such as Young’s modulus, Poisson’s ratio, nanohardness, yield strength, fracture strength, and residual stress in thin films requires specialised approaches and advanced technological implementations. Significant progress is made in this field over the past decade, driven by the introduction of focused ion-beam milling, atomic-force microscopy, computational modelling methods, and modern x-ray diffraction capabilities. These advanced tools, in conjunction with indentation, bending, scratching, and tensile testing techniques, form a versatile toolkit for the mechanical characterisation of thin films. This review discusses the concepts and principles, advantages, limitations, measurement parameters, and advancements in each method, including those introduced in recent years. Additionally, the influence of film thickness on mechanical properties is examined, highlighting how dimensional constraints alter material behaviour at the nanoscale level. A structured methodology is proposed to guide the selection of appropriate testing methods based on film thickness, target mechanical parameters, and experimental limitations, providing a systematic framework for future research and practical applications.

Keywords: mechanical properties, thin films, nanoindentation, tensile testing, microcompression, Young’s modulus, overstress.

DOI: https://doi.org/10.15407/ufm.26.04.***

Citation: V.O. Burlakov and O.V. Filatov, Advances in Mechanical Testing of Thin Films, Progress in Physics of Metals, 26, No. 4: ***–*** (2025)

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